AMKR

$AMKR $AMAT $LRCX $KLAC 今天盘中都大涨； 昨天提到的标的，都不错， $AMKR 涨11%； 恭喜跟上的小伙伴们！ https://x.com/lordwilliamuk/status/2059387613602042311?s=46

华为韬（τ）定律引发半导体新格局？利空什么，利好什么？ 利好侧： 1.先进封装需求大增；利好 $AMKR $ASX 2.3D堆叠设备需求爆发, 利好 $AMAT $LRCX $KLAC https://x.com/lordwilliamuk/status/2058933296881344914?s=46

This is interesting. $AMKR Amkor is a major supplier for $INTC Intel. Amkor and Intel announced a major collaboration focused on EMIB (Embedded Multi-Die Interconnect Bridge) advanced packaging last year. This expands capacity in Korea, Portugal, and the upcoming U.S. Arizona facility. It’s Intel’s first outsourcing of high-end EMIB packaging (e.g., to Amkor’s Songdo, Korea fab), driven by strong AI chip demand. Amkor has repeatedly earned Intel’s Preferred Quality Supplier Award for outstanding performance in packaging and services. Amkor supports Intel’s foundry ecosystem and advanced packaging needs (including glass substrates work). Their Arizona campus positions them near Intel facilities for a stronger U.S. supply chain. With Amkor supporting $AMD for advanced packaging, what gives?

OpenAI收入不如预期， $AMKR 被sell the news, 转折信号？ https://x.com/lordwilliamuk/status/2049074785456369884?s=46

SPX 7120 止盈了1/4仓位，盈利超20-50%不等 $AMKR $AMD $INTC $EWY $AMZN 等 https://x.com/lordwilliamuk/status/2046606323484156258?s=46

$AMKR 2周盈利超40%，恭喜大家！接下来关注什么？ 止盈了部分 $AMKR ； https://x.com/lordwilliamuk/status/2044066342551064728?s=46

昨天加仓全面盈利， $EWY 24小时盈利超6%，$AMKR 盈利5%， $AMD $IWM 盈利也不错； 盘前都止盈了20%； https://x.com/lordwilliamuk/status/2039326421605064725?s=46

战争转折的信号，多军要冲锋了！ 200买入了 $AMD 118 买入了 $EWY 44 买入了 $AMKR 246 买入了 $IWM https://x.com/lordwilliamuk/status/2039026449949085829?s=46

$INTC x $QCOM IS HAPPENING? - Qualcomm's job listing for a Senior Staff Packaging Engineer seeks experience with EMIB, Intel's proprietary 2.5D interconnect technology for high-bandwidth multi-die integration, as a preferred skill, hinting at potential integration into their high-performance computing chips. - This mention aligns with reports of Qualcomm as Intel Foundry's first major customer for the 20A (2nm) process, signaling a strategic diversification from $TSM to leverage Intel's advanced packaging for improved yield and cost in complex SoCs. - Intel's recent expansions, like the $AMKR partnership for EMIB capacity, position it as a viable alternative in the packaging ecosystem, where EMIB enables denser interconnects than traditional methods, potentially boosting Qualcomm's AI and edge computing performance. Thank you @christophauto for this catch!